Entech Electronics provides a comprehensive range of quality accredited contract manufacturing and product assembly services to the International electronics industry. Our in-house and contract partners include the following capabilities:

Component Procurement & Management Service

• Domestic and International supply lines.
• Procurement teams in Shenzhen and Australia.
• Customs arrangements and documentation for importation of client supplied components (FIA) available.
• Sourcing of wire looms, including over moulds and semi rigid moulding, all custom and commodity cables.
• Metal fabrication, casting and extrusion, including all finishes and pad printing.
• Plastics tooling and manufacture.

 Assembly facilities

• Entech partners with 4 assembly facilities as well as in-house capabilities to provide any volume requirement.
• Lead free processing.
• Through Hole Assembly Lines.
• Dual Wave, Wave Soldering machine.
• Fine Pitch QFP to 0.5mm.
• BGA to 0.3mm.
• Chip components 0201.
• PCB size 30-510mm.
• Mixed technology assembly.
• Mechanical and box build assembly.

Testing 

• MDA (Bed of Nails using HP3065 & HP3070).
• Full functional testing using dedicated Jigs and fixtures.
• Functional testing (Teradyne A360, Geotester).
• X-Ray and Optical inspection facility for BGA placement.
• PC based test systems (Dedicated, JTAG/Boundary Scan).

Turnkey product manufacturing

• Total product build.
• Packaging and warehousing including manuals, CDs, literature and cartons.
• Shipping direct to the end user.

Other services

• Design advice on suitability for manufacture (DFM).
• Engineering support including PCB layouts and design.
• Production tooling and test jig design and manufacture.