Entech Electronics provides a comprehensive range of quality accredited contract manufacturing and product assembly services to the International electronics industry. Our in-house capabilities include:

Component Procurement & Management Service

• Domestic and International supply lines.
• Procurement teams in Shenzhen and Australia.
• Customs arrangements and documentation for importation of client supplied components (FIA) available.
• Sourcing of wire looms, including over moulds and semi rigid moulding, all custom and commodity cables.
• Metal fabrication, casting and extrusion, including all finishes and pad printing.
• Plastics tooling and manufacture.

 Assembly facilities

• Complex manufacturing facilities in Adelaide, Australia and Shenzhen, China.
• Lead free processing.
• Through Hole Assembly Lines.
• Dual Wave, Wave Soldering machine.
• Fine Pitch QFP to 0.5mm.
• BGA to 0.3mm.
• Chip components 0201.
• PCB size up to 510mm.
• Mixed technology assembly.
• Mechanical and box build assembly.

Testing 

• MDA (manufacturing defects analysis) testing.
• Full functional testing using dedicated Jigs and fixtures.
• X-Ray and Optical inspection facility for BGA placement.
• PC based test systems (Dedicated, JTAG/Boundary Scan).
• Flying Probe testing

Turnkey product manufacturing

• Project management and complete product life-cycle management.
• Packaging and warehousing including manuals, CDs, literature and cartons.
• Shipping direct to the end user.

Other services

• Design advice on suitability for manufacture (DFM).
• Engineering support including PCB layouts and design.
• Production tooling and test jig design and manufacture.