• Contract Assembly


Entech Electronics provides a comprehensive range of quality accredited contract manufacturing and product assembly services to the International electronics industry. Our in-house capabilities include:

Component Procurement & Management Service

  • Domestic and International supply lines.
  • Procurement teams in Shenzhen and Australia.
  • Customs arrangements and documentation for importation of client supplied components (FIA) available.
  • Sourcing of wire looms, including over moulds and semi rigid moulding, all custom and commodity cables.
  • Metal fabrication, casting and extrusion, including all finishes and pad printing.
  • Plastics tooling and manufacture.

 Assembly facilities

  • Complex manufacturing facilities in Adelaide, Australia and Shenzhen, China.
  • Lead free processing.
  • Through Hole Assembly Lines.
  • Dual Wave, Wave Soldering machine.
  • Fine Pitch QFP to 0.4mm.
  • BGA to 0.4mm.
  • Chip components 0201.
  • PCB size up to 510mm.
  • Mixed technology assembly.
  • Mechanical and box build assembly.

Testing 

  • MDA (manufacturing defects analysis) testing.
  • Full functional testing using dedicated Jigs and fixtures.
  • X-Ray and Optical inspection facility for BGA placement.
  • PC based test systems (Dedicated, JTAG/Boundary Scan).
  • Flying Probe testing

Turnkey product manufacturing

  • Project management and complete product life-cycle management.
  • Packaging and warehousing including manuals, CDs, literature and cartons.
  • Shipping direct to the end user.

Other services

  • Design advice on suitability for manufacture (DFM).
  • Engineering support including PCB layouts and design.
  • Production tooling and test jig design and manufacture.

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