• Printed Circuit Boards

Manufacturing capability for single, double sided and multilayer printed circuit boards. Where tighter tolerances are required then these must be referred to Entech’s Customer Liaison Engineers.

  1. BOARD SIZES – PLATED THROUGH HOLE. (dependant on board finish)
    Maximum Board Dimensions 23.0” x 35” (585mm x 890mm) or 21.5" x 47" (546mm x 1200mm)
    Minimum Board Dimensions 0.4” x 0.4” (10mm x 10mm)
    Maximum Print & Etch 21.5” x 47” (546mm x 1200mm)
  2. BOARD SIZES MULTILAYER.
    Maximum Board Dimensions 23” x 30” (585mm x 762mm)
    Minimum Board Dimensions 0.4” x 0.4” (10mm x 10mm)
  3. BOARD THICKNESS.
    Minimum 0.006” (0.2mm)
    Maximum 0.275” (7.0mm)
  4. MINIMUM PLATED HOLE DIAMETERS.
    Minimum diameter plated through component hole 0.024”
    Minimum diameter plated through via hole 0.006”
    Note: Via holes may block during plating or solder coating and hence are not subject to tolerance limits.
  5. MINIMUM TRACK WIDTHS AND SPACINGS - To be used as a guide only (Finished copper weight)
    1oz
    Minimum conductor width 3.5mil
    Minimum conductor spacing 4mil
    2oz
    Minimum conductor width 5mil
    Minimum conductor spacing 7mil
    3oz
    Minimum conductor width 6mil
    Minimum conductor spacing 8mil
    4oz
    Minimum conductor width 7mil
    Minimum conductor spacing 12mil
    5oz
    Minimum conductor width 8mil
    Minimum conductor spacing 15mil
    6oz
    Minimum conductor width 10mil
    Minimum conductor spacing 18mil
  6. HOLE DIAMETERS TOLERENCES RANGE - DRILLED HOLES.
  7. HOLE DIAMETERS TOLERANCE RANGE PLATED THROUGH HOLES.
    Up to 1.00mm ± 0.05mm
    1.00mm to 2.00mm ± 0.075mm
    Above 2.00mm ± 0.075mm
  8. DRILLED HOLE POSITIONAL TOLERANCE.
    Located from films 0.003”
    Derived from CAD tape, outer layers 0.003”
  9. MACHINE CUTTING TOLERANCE.
    NC Routing ± 0.004”
    Standard Router 0.079”
    Minimum Router 0.032”
    V-groove (center of V to nearest feature) 0.016” (0.4mm)
  10. PLATING THICKNESS CONTROL.
    Acid Copper Plating.
    ± 15% Dependant on area distribution.
    Each batch is measured for plated through hole copper thickness by non-destructive testing and a statistical profile is kept on record.
  11. REGISTRATION TOLERANCE (PAD/HOLE RATIO).
    Finished minimum Annular Ring is 0.001” based on a minimum circuit pad of drilled hole diameter plus 0.012”, 0.016” preferred. Holes classified as via holes, may have pad breakout except at the track to pad junction - we suggest use of teardrop or filleted pads.
    Inner layer clearance requirements are drilled hole size plus 0.008” minimum, 0.012” preferred.
  12. REGISTRATION TOLERANCE SOLDER RESIST.
    Photo liquid imageable solder mask 0.003” oversize
    Minimum Soldermask web between SMD pads 0.004”
  13. NOTATION COMPONENT CODE.
    Alignment positional tolerance ± 0.008”
  14. MINIMUM TRACK WIDTHS AND SPACINGS.
    Minimum conductor width 0.004”
    Minimum conductor spacing 0.004”
    Note: Dependant on copper weight specified.
  15. FINISHES AVAILABLE.
    Lead Free HAL
    HAL
    Immersion Tin
    OSP
    Hard Gold
    Copper
    Flash Gold
    Electroless Nickel/Immersion Gold, for SMD applications
    Graphite/Carbon Ink
    Immersion Silver
  16. SOLDER MASKS AVAILABLE.
    Photo imageable solder mask (Standard colour is green, other colours available on request)
    UV soldermask
    Peelable solder mask
  17. BARE BOARD TESTING.
    Fixturing system software gives double sided SMD test capability.
    Active test points 20,480 (16” x 12.8”) on the primary side & 10,240 active test points on the secondary side.
    Maximum Test Area = 18"x18"
    For Double sided testing configured as 15360 test points on bottom(12.6”x12.0”) and 12288 test points on the top side ( 12.6”x9.6”). Isolation Stimulus Voltage 10V to 250V.
    Continuity resistance 1 Ohm – 10 K Ohms.
    Isolation resistance is programmable to 10K to 100 MegOhms
    Pitch 0.020”
    Flying Probe Testers.
    Maximum Board Size= 26”x35”
    Maximum Test Area= 25”x34”
    Optical Registration= 0.003"
    Continuity resistance from 1 Ohm
    Test Voltage to 500V/100 MOhm.
    Resistance 10 Ohm to 50 Mohms.
    Smallest Test pad= 0.004”.
    Fault Verification/ Repair and Retest
  18. BASE LAMINATES USED.
    Epoxy woven glass prepregs, copper clad FR4. Other substrates such as Teflon, Aliminium backed FR4 etc., available on request.
    Laminates = ITEQ, Shengyi, GETEK, Arion, Taconic, Rogers, Nelco
  19. APPROVALS HELD BY ENTECH
    Quality endorsed to ISO 9001. QEC 200.
    AUTOMATED TOOLING SYSTEM.
  20. MACHINING.
    NC Drilling – NC Routing, NC – Milling, “V” Grooving – Edge Beveling, Jump "V" Grooving.
  21. ADDITIONAL FEATURES.
    Membrane switches, Decals, specialist screen printers, digital printing, Wave soldering, Automated SMD assembly, solder paste stencils, exotic substrates, flexibles, NC Milling, HDI circuits, Aliminium backed circuits, Laser drilling.
  22. BATCH SIZES.
    Minimum quantity – one.
    Maximum quantity – negotiable.
  23. MANUFACTURING SPECIFICATIONS.
    Unless otherwise specified, IPC-600 class II and IPC-6012 class II standard shall be followed

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